Preparation of heat dissipation structure of diamond
The invention relates to a method for preparing open heat dissipation structure of complete diamond, which is characterized in that the through-hole structure of molybdenum sheet is realized by precision machining. By laser cutting of high quality self-supporting diamond thick plate, diamond bars matching the aperture of molybdenum plate were obtained and filled into the holes of molybdenum plate. Then the diamond was regrown on the upper and lower parts of the molybdenum plate until the diamond was fully covered on the surface. Finally, the open diamond heat dissipation structure was obtained by removing the molybdenum plate.
1. Precision machining drilling of molybdenum plate;
The polished molybdenum plate was drilled with different hole sizes or different hole distances.
2. Preparation and filling of diamond rod;
In order to ensure the horizontal consistency of the upper and lower surfaces of the molybdenum plate, the diamond rods with the same size were obtained by the laser cutting technology of the ultra-thick CVD diamond plate which had been ground and polished by DC arc plasma jet.
3. Pretreatment of the upper and lower surface of molybdenum plate filled with diamond rod;
The molybdenum plate filled with diamond rod was ground and polished, and the diamond nanometer powder solution was added for double-sided polishing. The surface roughness was as low as 10nm-500nm, so that the surface roughness of molybdenum plate and diamond rod at both ends was the same and the surface concave and convex could be attached to the nanometer diamond powder.
4. Pretreatment of the upper surface of molybdenum plate and growth of diamond;
The surface of molybdenum plate filled with diamond rod was coated with nanometer diamond powder solution, and the solution was heated in the oven to remove the moisture. Molybdenum plate filled with diamond rod was used as the substrate for diamond growth.
5. Grinding and polishing of the diamond layer on the upper surface of molybdenum plate after growing diamond;
The upper surface of molybdenum plate with diamond film layer was ground and placed on diamond polishing disc to make the surface roughness as low as 10nm-500nm.
6. Pretreatment of the lower surface of molybdenum plate and growth of diamond;
Before growing diamond on the lower surface of molybdenum plate upwards, a thin molybdenum sheet with similar thickness to the long diamond layer was added between the upper surface with long diamond film layer and the substrate to ensure that the growth conditions of diamond on the lower surface of molybdenum plate were the same as those on the upper surface.
7. Grinding and polishing of the lower surface of molybdenum plate for growing diamond;
The surface roughness of diamond film on the lower surface of molybdenum plate filled with diamond rod is also as low as 10nm-500nm.
8. Molybdenum plate removal
The molybdenum plate filled with diamond rod with double growth diamond was removed by acid treatment, and the open diamond heat dissipation structure was obtained.
