Preparation of molybdenum target material
In the electronic industry, the display technology of flat panel display equipment is developing continuously. The flat-panel display device formed by the emission extreme of molybdenum deposition has the advantages of wide viewing angle, fast response time and low power consumption, and has become the main force in the development of flat-panel display devices. Most flat-panel display processes use vacuum sputtering to deposit molybdenum on the emission extremes.
Vacuum sputtering is caused by the collision between electrons and argon atoms in the process of accelerating the flight to the substrate under the action of electric field, ionizing a large number of argon ions and electrons, the electrons fly to the substrate, argon ions accelerate the bombardment of the target under the action of electric field, sputtering a large number of target atoms, forming neutral target atoms (or molecules) on the substrate film, and finally achieve the purpose of coating the substrate surface.
Molybdenum sputtering target material is used in vacuum sputtering process of molybdenum deposition. Early molybdenum targets were obtained by fusion casting. However, the density of the molybdenum targets formed by fusion casting is difficult to control. In order to overcome this problem, molybdenum sputtering target is processed by powder metallurgy in the industry. The powder metallurgy process is to make molybdenum powder (with or without non-metallic powder), shape and sintering the molybdenum powder, and then make molybdenum target.
Our company can produce molybdenum target, molybdenum sheet, molybdenum foil, molybdenum wire, molybdenum processing workpiece according to customer needs.
