Molybdenum-copper alloy foil and preparation method thereof
Molybdenum-copper alloy is a kind of composite material composed of two phases of molybdenum and copper, which is neither solid solution nor compound formation. It has both high melting point, low expansion performance of molybdenum and high electrical and thermal conductivity performance of copper. The indissolubilization between the two components makes them present a specific combination of the properties of the two elements after composite, which can be flexibly and accurately designed according to the requirements of use. Due to these excellent properties, molybdenum copper alloy is widely used in electronic packaging materials, electrical contact materials, heat sink materials and so on.
With the continuous development of the electronic industry, molybdenum-copper alloy is widely used, and there are higher requirements for specifications and properties of molybdenum-copper alloy foil has become one of the most widely used varieties. The technical requirements for molybdenum-copper alloy foil mainly include :(I) high dimensional accuracy. The thickness of the material will directly affect its performance, which is also the difficulty of the preparation technology. (2) Good surface quality. Molybdenum copper alloy foil surface can not have pits, cracks and other defects, after shearing and other simple processing can be used; (3) Good performance. As molybdenum-copper alloy foil for electronic industry, it is required to have good thermal conductivity, low thermal expansion coefficient, strength and toughness.
Due to the insoluble elements of molybdenum and copper alloy, molybdenum and copper can not form an alloy, so the general smelting method is difficult to produce the alloy. At present, the preparation of molybdenum-copper alloy is mainly by powder metallurgy, among which the performance of molybdenum-copper alloy obtained by liquid phase sintering and melting is the best, but the molybdenum-copper series alloy obtained by the two methods is generally rod and plate. Molybdenum-copper alloy foil can be obtained by rolling molybdenum-copper alloy sheet. Generally, deformation processing of powder metallurgy products is difficult. The heating temperature requirements are high in the processing process, and the process is difficult to control. In view of the urgent demand for high-performance molybdenum-cu alloy foil in electronics industry, it is necessary to find a method for preparing molybdenum-cu alloy sheet and subsequent rolling process.
