Molybdenum sputtering targets for semiconductors
Today, sputtering targets are used in a wide range of applications, from the semiconductor industry to film deposition of various materials used in integrated circuit processing to energy-efficient glazing in buildings, the familiar golden hard coating made of titanium nitride and wear-resistant coatings for tools and consumer goods. Deposition of metals in CD and DVD production, all materials can be obtained in the form of sputtering targets.
Sputtering is a proven technique for depositing thin films of a variety of materials onto substrates of various shapes and sizes. The process is repeatable and can scale from small projects to production involving medium to large substrate areas. The sputtering gas is usually inert, such as argon. To transfer momentum effectively, the mass of the incident particle must match the mass of the target.
In order to obtain the desired properties in the films deposited by sputtering, the manufacturing materials and processes used to manufacture the sputtering target are critical. In addition to tungsten, molybdenum, niobium, titanium, silicon and other pure metal targets, tungsten, molybdenum, titanium, silicon, tantalum and other alloy targets, compounds such as oxides or nitride. The process of determining the material is just as important as the deposition operation parameters perfected by engineers and scientists during the coating process.
Compared with other deposition methods, the sputtering film has better adhesion on the substrate, and the materials with high melting point such as molybdenum and tungsten are also easy to sputter. Sputtering can be carried out from top to bottom, while evaporation can only be carried out from bottom to top.
Sputtering targets are usually round or rectangular, and other shapes can be made, including square and triangular designs. A substrate is an object to be coated, which can include semiconductor wafers, solar cells, optical modules or many other possibilities. The thickness of the coating is usually in the angstrom to micron range. Thin films can be either a single material or a variety of materials with multilayer structures.
As a refractory metal with a wide range of applications, molybdenum has excellent mechanical properties at high temperatures, low expansibility, high thermal conductivity and high electrical conductivity. As sputtering target, there can be very many combinations, such as pure molybdenum target, molybdenum titanium target, molybdenum tantalum target, molybdenum alloy target (such as TZM plate). Molybdenum sputtering target has the characteristics of high purity, high density, fine and uniform grain size, so as to obtain high sputtering efficiency, uniform film thickness and smooth etching surface.
