Mosten Alloy Co., Ltd.

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Mosten Alloy Co., Ltd.

Chips and targets

  • Mosten
  • 16 Dec

Chip is a kind of component produced after integrated circuit design process. Target material is an essential raw material for IC manufacturing. Which makes use of the ion, ion source through accelerating gathered in the high vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface, ions and solid surface atomic momentum exchange, from solid surface atomic solid and deposition in the basal surface, bombarded solid is sputtering deposition film of raw materials, known as the sputtering target materials. The components that need sputtering coating technology in integrated circuit include dielectric layer, conductor layer, protective layer, barrier layer and diffusion layer. At present, the main target materials used for coating are tungsten target, tungsten titanium target, molybdenum target, titanium target and so on, and their purity is generally more than 5N (99.999%).

Tungsten target is a kind of tungsten powder as the main raw material of the product, not only has higher purity and density, but also lower oxygen content, smaller average transparent texture diameter, larger deflection force, structure and composition uniformity, and so on, so that the quality of the coating products produced can be higher. In addition, the cost of tungsten targets made by powder metallurgy is more reasonable than other targets such as titanium.

Molybdenum target, also known as molybdenum sputtering target, physical and chemical properties and raw materials (pure molybdenum or molybdenum alloy) are not much different, with high melting point, high conductivity, low specific impedance, good corrosion resistance and environmental health characteristics, so it is also a raw material for coating. So, what kind of sputtering target material should be selected in the production process of integrated circuits? The technology and purity of semiconductor target materials are much higher than flat display, solar cell and other applications, so it is more suitable for tungsten target, molybdenum target, etc.