High volume fraction SiC particles reinforced Cu matrix composites were prepared by pressureless infiltration
Traditional electronic packaging materials have limited thermal conductivity, which has been difficult to meet the rapid development of the electronic industry. Metal matrix composite (MMCs) is a kind of high-performance electronic packaging materials, which is usually reinforced with ceramic (fiber, whisker and particle) and metal matrix. It has the properties of metal easy processing, high thermal conductivity, high electrical conductivity and ceramic reinforcement lightweight, low expansion, while it also has good dimensional stability, high wear resistance and corrosion resistance and performance can be designed. These advantages make metal matrix composites an excellent alternative to traditional electronic packaging materials. Compared with Al, Cu has better thermal conductivity, but its thermal expansion coefficient is too different from that of silicon chip, and it is easy to produce thermal stress in the process of use. The introduction of SiC reinforcement with low expansion coefficient can significantly reduce the thermal expansion coefficient of the material. At present, most of the SiC particle reinforcement, for high volume fraction SiC particle reinforcement is less. Compared with the particle reinforcement with low volume fraction, the high volume fraction reinforcement has better strength and lower thermal expansion coefficient. The performance of electronic packaging materials is improved.
Partial ammonium tungstate sol in to the frame of the porous silicon carbide ceramics, and then calcined tungsten oxide, is obtained by hydrogen reduction of tungsten coating again, thus formed on the surface of porous silicon carbide ceramics framework channel tungsten coating, at 1300 ℃, the wetting Angle of tungsten and copper is less than 10 °, has good wettability, so tungsten coating improved the wettability of silicon carbide, silicon and copper oxide, In order to ensure that the high volume fraction SiC particles reinforced Cu matrix composites can be obtained by non-pressure infiltration method, so that the copper can be well immersed in silicon carbide ceramics. The method of the invention is not restricted by the product morphology, is easy to prepare complex shape parts, and has the advantages of simple equipment, low cost and environmental friendliness.
