Matters needing attention in tungsten copper electroplating
W-Cu alloy is a two-phase "pseudo alloy" composed of tungsten and copper. Because tungsten is insoluble with other metals, it is difficult to electroplate W-Cu alloy. Tungsten copper alloy electroplating claims are as follows: 1. Tungsten copper must be cleaned before electroplating, using ultrasonic + neutral cleaning solution to clean the surface of tungsten and copper oxide, oil stains and other dirty substances, enhance the adhesion of tungsten copper surface. Cleaning agent to prevent strong acid and alkali substances. 2. The interval between cleaning and electroplating technology should not be too long, that is to say, electroplating immediately after cleaning. 3. Before electroplating, the samples should be electroplated according to the existing electroplating technology of the electroplating plant, and the tungsten copper after electroplating should be placed in a vacuum furnace at 800 ° for 20 minutes for aging test. If there are no bubbles, discoloration and other defects in the tungsten copper plating, it is clarified that there is no problem with the electroplating technology, and the next step of tungsten copper electroplating can be carried out according to this technology. If there are bubbles and other problems, please discuss the electroplating technology with the electroplating supplier.
